SG187 Motorola / Freescale Semiconductor, SG187 Datasheet - Page 33

• Manufacturer Part Number: SG187
• Description: Automotive Selector Guide 2Q, 2001
• Manufacturer: Motorola / Freescale Semiconductor

ADC — Analog-to-Digital Converter
BDM — Background Debug Mode
CAN — Controller Area Network
CDIP — Ceramic Dual In-Line Package
CLCC — Ceramic Leaded Chip Carrier
COP — Computer Operating Properly (Watchdog Timer)
CPU16 — 16-Bit Central Processor Unit (HC11 Compatible)
CPU32 — 32-Bit Central Processor Unit (68000 Compatible)
CTM — Configurable Timer Module (Various Hardware Options)
DIP — Dual In-line Package
DTMF — Dual-Tone Multi-Frequency
EBI — External Bus Interface
GPT — General-Purpose Timer Module (4 IC, 5 OC, 2 PWM)
IC — Input Capture
I
i/o — Bidirectional Input and Output Port Pins
i — Input-Only Port Pins
ISPI — Interval Serial Peripheral Interface
KBI — Keyboard Interrupt
LCD — Liquid Crystal Display
LTD — Limited Availability
LQFP — Low-Profile Quad Flat Pack
LVI — Low-Voltage Interrupt
LVR — Low-Voltage Reset
MC — Fully Qualified Production
MCCI — Multi-Channel Communication Interface (2 SCI, SPI)
MFT — Multi-Function Timer
MUX — Multiplexed
o — Output-Only Port Pins
OC — Output Compare
PC — Pre-Qualification, Engineering Samples Only
PEEP — Personality EEPROM
PEP — Personality EPROM
PLCC — Plastic Leaded Chip Carrier
PLL — Phase-Locked Loop
PQFP — Plastic Quad Flat Pack
PWM — Pulse-Width Modulation
2
C — Inter-Integrated Circuit
68HC05 Family
— Definitions —
Definitions
QADC — Queued Analog-to-Digital Converter (10-Bit)
QFP — Quad Flat Pack
QSM — Queued Serial Module (SCI + QSPI)
QSPI — Queued SPI
RTI — Real-Time Interrupt
SCI — Serial Communication Interface
SCI+ — Enhanced SCI
SCIM — Single-Chip Integration Module
SDIP — Shrink Dual In-line Package
SIM — System Integration Module
SIML — Low-Power System Integration Module
SIOP — Simple Serial I/O Port
SPI — Serial Peripheral Interface
SPI+ — Enhanced SPI
SRAM — Standby RAM Module
TPU — Time Processor Unit (16 Programmable Channels)
TPURAM — Standby RAM Module with TPU Emulation Capability
UART — Universal Asynchronous Receiver/Transmitter
USB — Universal Serial Bus
XC — Initial Production Qualification, Not Fully Characterized
B — Shrink DIP (70 mil spacing)
DW — Small Outline (Wide-Body SOIC)
FA — 7 x 7 mm Quad Flat Pack (QFP)
FB — 10 x 10 mm Quad Flat Pack (QFP)
FE — CQFP (windowed) — Samples Only
FN — Plastic Quad (PLCC)
FS — CLCC (windowed) — Samples Only
FT — 28 x 28 mm Quad Flat Pack (QFP)
FU — 14 x 14 mm Quad Flat Pack (QFP)
FZ — CQFP (windowed) — Samples Only
K — Cerdip (windowed) — Samples Only
L — Ceramic Sidebraze
P — Dual in-Line Plastic
PU — 14 x 14 mm Low-Profile Quad Flat Pack (LQFP)
PV — 20 x 20 mm Low-Profile Quad Flat Pack (LQFP)
S — Cerdip (windowed) — Samples Only
TM — Mechatronics Connector
— Package Designators —