LTC2298 Linear Technology, LTC2298 Datasheet - Page 27

• Manufacturer Part Number: LTC2298
• Description: (LTC2296 - LTC2298) Low Power 3V ADCs
• Manufacturer: Linear Technology

PACKAGE DESCRIPTIO
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1 TOP MARK
(SEE NOTE 5)
9 .00 ± 0.10
(4 SIDES)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.50 BSC
0.25 ±0.05
U
64-Lead Plastic QFN (9mm × 9mm)
(Reference LTC DWG # 05-08-1705)
0.70 ±0.05
7.15 ±0.05
(4 SIDES)
PACKAGE OUTLINE
0.75 ± 0.05
UP Package
8.10 ±0.05 9.50 ±0.05
7.15 ± 0.10
(4-SIDES)
0.200 REF
0.00 – 0.05
LTC2298/LTC2297/LTC2296
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
CHAMFER
PIN 1
0.50 BSC
0.25 ± 0.05
63
64
(UP64) QFN 1003
27
0.40 ± 0.10
1
2
229876f