LTC2852 Linear Technology, LTC2852 Datasheet - Page 13

• Manufacturer Part Number: LTC2852
• Description: 3.3V 20Mbps RS485/RS422 Transceivers
• Manufacturer: Linear Technology

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PACKAGE DESCRIPTION
3.50 ±0.05
2.15 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
0.25 ± 0.05
1.65 ±0.05
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
(2 SIDES)
3.5 ±0.05
2.15 ±0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
1.65 ±0.05
(2 SIDES)
(NOTE 6)
0.50
BSC
0.25 ± 0.05
PIN 1
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
0.675 ±0.05
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
10-Lead Plastic DFN (3mm × 3mm)
PACKAGE
OUTLINE
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
(Reference LTC DWG # 05-08-1698)
2.38 ±0.05
(2 SIDES)
0.50
BSC
(SEE NOTE 6)
TOP MARK
DD Package
DD Package
PIN 1
0.200 REF
0.675 ±0.05
3.00 ±0.10
0.75 ±0.05
(4 SIDES)
PACKAGE
OUTLINE
0.00 – 0.05
LTC2850/LTC2851/LTC2852
1.65 ± 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
R = 0.115
3.00 ±0.10
0.75 ±0.05
(4 SIDES)
TYP
4
5
2.38 ±0.10
(2 SIDES)
0.00 – 0.05
1.65 ± 0.10
(2 SIDES)
8
1
0.50 BSC
0.38 ± 0.10
BOTTOM VIEW—EXPOSED PAD
(DD) DFN 1203
5
R = 0.115
6
2.38 ±0.10
(2 SIDES)
TYP
10
1
0.50 BSC
0.25 ± 0.05
0.38 ± 0.10
(DD) DFN 1103
13
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