ESD0501B2C Weitron Technology, ESD0501B2C Datasheet - Page 2

• Manufacturer Part Number: ESD0501B2C
• Description: Surface Mount TVS
• Manufacturer: Weitron Technology

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Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only.
Functional operation above the Recommended. Operating Conditions is not implied. Extended exposure to
stresses above the Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
Maximum Ratings
ELECTRICAL CHARACTERISTICS (T
IEC61000−4−2(ESD)
ESD voltage
Total power dissipation on FR-5 board (Note 1)
Thermal Resistance Junction−to−
Lead Solder Temperature − Maximum (10 Second Duration)
Junction and Storage temperature range
ELECTRICAL CHARACTERISTICS (T
Symbol
I
V
V
I
V
I
I
V
P
C
ESD3301B2C
ESD0501B2C
ESD1201B2C
*Other voltages available upon request.
2. V
3. Surge current waveform per Figure 3.
PP
R
T
F
ESD0501B2C
C
RWM
BR
F
pk
WEITRON
BR
Device*
is measured with a pulse test current I
Maximum Reverse Peak Pulse Current
Clamping Voltage @ I
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @ V
Breakdown Voltage @ I
Test Current
Forward Current
Forward Voltage @ I
Peak Power Dissipation
Max. Capacitance @V
Marking
Device
C
A
B
(T
Parameter
V
A
F
RWM
Max
3.3
5.0
P
12
PP
=25°C unless otherwise noted)
R
a
T
=0 and f =1MHz
(V)
a r
A
= 25°C unless otherwise noted,
m
A
t e
m
T
I
r e
R
@ V
Max
b
A
at an ambient temperature of 25°C.
2.5
1.0
1.0
(μA)
e i
per human body model
= 25°C unless otherwise noted)
RWM
t n
RWM
Per machine model
V
I
T
(Note 2)
BR
13.5
Min
5.0
6.2
(V) @
2/3
mA
1.0
1.0
1.0
Contact
I
T
V
F
= 0.9 V Max. @ I
Max I
(Note 3)
9.8
8.7
5.9
-
PP
(A)
S
F
T
y
V
R
= 10mA for all types)
j,
C
m
P
(A) (Note 3)
T
θJA
(V) @Max I
T
D
L
b
stg
11.4
12.3
23.7
Max
l o
PP
-55 ~ +150
Limits
±30
(8 x 20μs)
400
150
833
260
16
P
102
107
140
pk
Typ
(W)
15-Apr-09
℃/W
Unit
C (pF)
mW
KV
KV
Typ
℃
℃
V
80
65
30