MC74HC574ANG ON Semiconductor, MC74HC574ANG Datasheet
MC74HC574ANG
Specifications of MC74HC574ANG
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MC74HC574ANG Summary of contents
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... Chip Complexity: 266 FETs or 66.5 Equivalent Gates • Pb−Free Packages are Available *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2009 20 PDIP−20 ...
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... O 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. 6. For high frequency or heavy load considerations, see the ON Semiconductor High−Speed CMOS Data Book (DL129/D). RECOMMENDED OPERATING CONDITIONS Symbol V DC Supply Voltage CC ...
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... ORDERING INFORMATION Device MC74HC574AN MC74HC574ANG MC74HC574ADW MC74HC574ADWG MC74HC574ADWR2 MC74HC574ADWR2G MC74HC574ADTR2 MC74HC574ADTR2G MC74HC574AF MC74HC574AFG MC74HC574AFEL MC74HC574AFELG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. ...
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... For propagation delays with loads other than 50 pF, and information on typical parametric values, see the ON Semiconductor High−Speed CMOS Data Book (DL129/D). ...
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SEATING PLANE 20X T 0. 18X PACKAGE DIMENSIONS PDIP−20 N SUFFIX CASE 738−03 ISSUE ...