ntf6p02 ON Semiconductor, ntf6p02 Datasheet

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ntf6p02

Manufacturer Part Number
ntf6p02
Description
Power Mosfet -20 V, -6.0a Single P-channel Sot-223
Manufacturer
ON Semiconductor
Datasheet

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Price
Part Number:
ntf6p02T3
Manufacturer:
ON SEMICONDUCTOR
Quantity:
30 000
Part Number:
ntf6p02T3G
Manufacturer:
ON SEMICONDUCTOR
Quantity:
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Part Number:
ntf6p02T3G
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Quantity:
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Part Number:
ntf6p02T3G
0
NTF6P02T3
Power MOSFET
-6.0 Amps, -20 Volts
P-Channel SOT-223
Features
Typical Applications
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Steady State.
2. When surface mounted to an FR4 board using 1” pad size,
3. When surface mounted to an FR4 board using minimum recommended pad
© Semiconductor Components Industries, LLC, 2007
July, 2007 - Rev. 2
MAXIMUM RATINGS
Drain-to-Source Voltage
Gate-to-Source Voltage
Drain Current (Note 1)
Total Power Dissipation @ T
Operating and Storage Temperature Range
Single Pulse Drain-to-Source Avalanche
Thermal Resistance
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
i.e.: Cellular and Cordless Telephones and PCMCIA Cards
Low R
Logic Level Gate Drive
Diode Exhibits High Speed, Soft Recovery
Avalanche Energy Specified
Pb-Free Package is Available
Power Management in Portables and Battery-Powered Products,
(Cu. Area 1.127 sq in), Steady State.
size, (Cu. Area 0.412 sq in), Steady State.
- Continuous @ T
- Continuous @ T
- Single Pulse (t
Energy - Starting T
(V
I
- Junction to Lead (Note 1)
- Junction to Ambient (Note 2)
- Junction to Ambient (Note 3)
L(pk)
DD
= -10 A, L = 3.0 mH, R
= -20 Vdc, V
DS(on)
Rating
p
A
A
= 10 ms)
GS
J
= 25°C
= 70°C
= 25°C
(T
= -5.0 Vdc,
J
A
= 25°C unless otherwise noted)
= 25°C
G
= 25W)
Symbol
T
V
R
R
J
R
V
E
I
P
, T
T
DSS
DM
I
I
qJA
qJA
GS
qJL
D
D
AS
D
L
stg
- 55 to
Value
+150
±8.0
-8.4
71.4
-20
-10
-35
150
160
260
8.3
15
1
°C/W
Unit
Vdc
Vdc
Adc
Apk
mJ
°C
°C
W
†For information on tape and reel specifications,
NTF6P02T3
NTF6P02T3G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1
CASE 318E
Device
(Note: Microdot may be in either location)
SOT-223
2
STYLE 3
R
A
WW
6P02
G
3
ORDERING INFORMATION
DS(on)
G
-6.0 AMPERES
http://onsemi.com
4
P-Channel MOSFET
-20 VOLTS
= Assembly Location
= Work Week
= Specific Device Code
= Pb-Free Package
= 44 mW (Typ.)
(Pb-Free)
SOT-223
SOT-223
Package
Publication Order Number:
S
Gate
ASSIGNMENT
D
1
MARKING
DIAGRAM
& PIN
4000/Tape & Reel
4000/Tape & Reel
AWW
Drain
Drain
6P02 G
Shipping
4
2
G
NTF6P02T3/D
3
Source

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ntf6p02 Summary of contents

Page 1

... Gate Drain Source A = Assembly Location WW = Work Week 6P02 = Specific Device Code G = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION † Device Package Shipping SOT-223 4000/Tape & Reel 4000/Tape & Reel SOT-223 (Pb-Free) Publication Order Number: NTF6P02T3/D ...

Page 2

... Fall Time Gate Charge SOURCE-DRAIN DIODE CHARACTERISTICS Forward On-Voltage (I Reverse Recovery Time Reverse Recovery Stored Charge 4. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2.0%. 5. Switching characteristics are independent of operating junction temperatures. NTF6P02T3 (T = 25°C unless otherwise noted -16 Vdc ...

Page 3

... GATE-TO-SOURCE VOLTAGE (VOLTS) GS, Figure 3. On-Resistance versus Gate-to-Source Voltage 1.4 1.2 1.0 0.8 0.6 -50 - JUNCTION TEMPERATURE (°C) J Figure 5. On-Resistance Variation with Temperature NTF6P02T3 25°C J ≥ - 0.5 -V GS, Figure 2. Transfer Characteristics 0. 25° ...

Page 4

... -3 -4 d(off) 100 d(on GATE RESISTANCE (W) G Figure 9. Resistive Switching Time Variation versus Gate Resistance NTF6P02T3 25° Drain-to-Source Voltage versus Total Charge 25° ...

Page 5

... TYPICAL ELECTRICAL CHARACTERISTICS 0.5 0.2 0.1 0.05 0.1 0.02 0.01 SINGLE PULSE 0.01 1.0E-03 1.0E-02 1.0E-01 NTF6P02T3 NORMALIZED TO R 0.0175 W 0.0710 W CHIP JUNCTION 0.0154 F 0.0854 F 1.0E+00 1.0E+01 t, TIME (s) Figure 11. FET Thermal Response http://onsemi.com 5 AT STEADY STATE (1″ PAD) qJA 0.2706 W 0.5779 W 0.7086 W 0.3074 F 1.7891 F 107.55 F AMBIENT 1.0E+02 1.0E+03 ...

Page 6

... DRAIN 3. SOURCE 4. DRAIN ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NTF6P02T3/D 10° ...

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