sidc05d60sic3 Infineon Technologies Corporation, sidc05d60sic3 Datasheet
sidc05d60sic3
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sidc05d60sic3 Summary of contents
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... Max. possible chips per wafer Passivation frontside Anode metalization Cathode metalization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment Edited by INFINEON Technologies HV3, Edition 1, 22.04.2004 SIDC05D60SIC3 Applications: SMPS, PFC, snubber Die Size Package 2 2A 0.84 x 0.59 mm sawn on foil ...
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... KV/mm at full blocking voltage. Dynamic Electrical Characteristics Parameter Symbol Total capacitive charge Q C Switching time Total capacitance C Edited by INFINEON Technologies HV3, Edition 1, 22.04.2004 SIDC05D60SIC3 Symbol Condition RSM = =10 ms sinusoidal ...
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... CHIP DRAWING: Edited by INFINEON Technologies HV3, Edition 1, 22.04.2004 SIDC05D60SIC3 840 632 ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies HV3, Edition 1, 22.04.2004 SIDC05D60SIC3 INFINEON TECHNOLOGIES SDT02S60 ...