ds25-2009-0037 LiteOn Technology Corp., ds25-2009-0037 Datasheet - Page 8

• Manufacturer Part Number: ds25-2009-0037
• Description: Liteon Power Led
• Manufacturer: LiteOn Technology Corp.

5. Reflow Soldering Characteristics
Part No.: LTPL-P00SVS57
BNC-OD-C131/A4
Notes:
1. The LEDs can be soldered using the reflow soldering or hand soldering method. The recommended
2. All temperatures refer to topside of the package, measured on the package body surface.
3. The soldering condition referring to J-STD-020B. If the LEDs were unpacked more than 72hrs, we
4. The soldering profile could be further referred to different soldering grease material characteristic. The
5. A rapid-rate process is not recommended for the LEDs cooling down from the peak temperature.
6. Although the recommended reflow conditions are specified above, the reflow or hand soldering
7. LiteOn cannot make a guarantee on the LEDs which have been already assembled using the dip
Profile Feature
Average Ramp-Up Rate (T
Preheat Temperature Min (T
Preheat Temperature Max (T
Preheat Time (t
Time Maintained Above Temperature (T
Time Maintained Above Time (t
Peak / Classification Temperature (T
Time Within 5° C of Actual Peak Temperature (t
Ramp – Down Rate
Time 25° C to Peak Temperature
hand soldering condition is 350°C max. and 2secs ma x. for one time only.
recommend baking the LEDs at 60℃ at least 12 hours before soldering process.
grease vendor will provide this information.
condition at the lowest possible temperature is desirable for the LEDs.
soldering method
T
T
Smax
Smin
T
T
Smin
P
L
to t
Smax
LITE-ON TECHNOLOGY CORPORATION
)
Smax
Smin
Smax
to T
L
)
)
)
P
25
Preheat, t
)
P
Property of Lite-On Only
°
)
C to Peak, t
L
)
S
Ramp-up
P
)
Time
8 minutes max
Lead Free Assembly
3° C / second max
150°C
200°C
60 – 180 seconds
217°C
60 – 150 seconds
260°C
5 seconds
6° C / second max
Ramp-dow n
t
t
P
L
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