upd6133 Renesas Electronics Corporation., upd6133 Datasheet - Page 57

no-image

upd6133

Manufacturer Part Number
upd6133
Description
4-bit Single-chip Microcontroller For Infrared Remote Control Transmission
Manufacturer
Renesas Electronics Corporation.
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD6133
Manufacturer:
KODENSHI
Quantity:
1
Part Number:
upd6133-488
Manufacturer:
NEC
Quantity:
634
Part Number:
upd6133-488
Manufacturer:
NEC
Quantity:
1 000
Part Number:
upd61333AF1-323-RNB-A
Manufacturer:
RENESAS
Quantity:
1 000
Part Number:
upd61333AF1-323-RNB-A
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Company:
Part Number:
upd61333AF1-323-RNB-A
Quantity:
51
Part Number:
upd61333AF1-323RNB-A
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Part Number:
upd61333F1-RNB-SSA-A
Manufacturer:
NEC
Quantity:
1 000
Part Number:
upd61335F-237-RNB
Manufacturer:
NEC
Quantity:
20 000
Part Number:
upd61335F1-237-RNB-A
Manufacturer:
RENESAS
Quantity:
20 013
Part Number:
upd61335F1-237-RNB-A
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Part Number:
upd6133G-445-T2
Manufacturer:
NEC
Quantity:
30 500
Part Number:
upd6133GS-403-E1
Manufacturer:
NEC
Quantity:
24 000
Part Number:
upd6133GS-524
Manufacturer:
NEC
Quantity:
1 000
Part Number:
upd6133GS-525
Manufacturer:
NEC
Quantity:
1 000
15. RECOMMENDED SOLDERING CONDITIONS
Technology Manual (C10535E).
sales representatives.
(1)
(2)
Soldering Method
Soldering Method
Infrared reflow
VPS
Wave soldering
Partial heating
Infrared reflow
VPS
Wave soldering
Partial heating
Carry out the soldered packaging of this product under the following recommended conditions.
For details of the soldering conditions, refer to information material Semiconductor Device Mounting
For soldering methods and conditions other than the recommended conditions, please consult one of our NEC
Caution Using more than one soldering method should be avoided (except in the case of partial heating).
Caution Using more than one soldering method should be avoided (except in the case of partial heating).
PD6133GS-
PD6134GS-
PD6134MC-
Package peak temperature: 235 C; time: 30 secs. max. (210 C min.);
count: twice max.
Package peak temperature: 215 C; time: 40 secs. max. (200 C min.);
count: twice max.
Solder bath temperature: 260 C max.; time: 10 secs. max.; count: once;
Preliminary heat temperature: 120 C max. (Package surface temperature)
Pin temperature: 300 ˚C or less ; time: 3 secs. max. (for each side of the device)
Package peak temperature: 235 C; time: 30 secs. max. (210 C min.);
count: three times max.
Package peak temperature: 215 C; time: 40 secs. max. (200 C min.);
count: three times max.
Solder bath temperature: 260 C max.; time: 10 secs. max.; count: once;
Preliminary heat temperature: 120 C max. (Package surface temperature)
Pin temperature: 300 ˚C or less ; time: 3 secs. max. (for each side of the device)
: 20-pin plastic SOP (300 mil)
: 20-pin plastic SOP (300 mil)
-5A4: 20-pin plastic SSOP (300 mil)
Table 15-1. Soldering Conditions for Surface-Mount Type
Data Sheet U10454EJ6V0DS00
Soldering Condition
Soldering Condition
PD6133, 6134
Recommended
Condition Symbol
Recommended
Condition Symbol
WS60-00-1
WS60-00-1
VP15-00-2
VP15-00-3
IR35-00-2
IR35-00-3
57

Related parts for upd6133