15mpa0566 Mimix Broadband, Inc., 15mpa0566 Datasheet - Page 3

• Manufacturer Part Number: 15mpa0566
• Description: 11.0-19.0 Gaas Mmic Power Amplifier
• Manufacturer: Mimix Broadband, Inc.

Bias Arrangement
Mechanical Drawing
Power Amplifier
September 2005 - Rev 01-Sep-05
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
RF In
Vd1,2
1
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Characteristic Data and Specifications are subject to change without notice. ©2005 Mimix Broadband, Inc.
(0.028)
0.731
2
(0.043)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
5
1.100
0.0
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Bond Pad #1 (RF In)
Bond Pad #2 (Vd1)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.810 mg.
Tel: [phone] Fax: [phone] mimixbroadband.com
0.0
3
1
their obligation to be compliant with U.S. Export Laws.
Vg
4
(Note: Engineering designator is 15MPA0566)
RF Out
(0.023)
Bond Pad #3 (Vd2)
Bond Pad #4 (RF Out)
0.600
(0.026)
2
0.659
5
(0.039)
1.000
3
Bypass Capacitors
Bond Pad #5 (Vg)
4
(0.055)
1.400
(0.012)
0.294
- See App Note [2]
15MPA0566
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