tc1806 Transcom, Inc., tc1806 Datasheet - Page 4

• Manufacturer Part Number: tc1806
• Description: 5w High Linearity And High Efficiency Gaas Power Fets
• Manufacturer: Transcom, Inc.

SMALL SIGNAL MODEL, V
SCHEMATI
CHIP HANDLING
DIE ATTACHMENT: Conductive epoxy or eutectic die attach is recommended. Eutectic die attach can be
accomplished with Au-Sn (80%Au-20%Sn) perform at stage temperature: 290 C
Time: less than 1min.
WIRE BONDING: The recommended wire bond method is thermocompression bonding with 0.7 to 1.0 mil
(0.018 to 0.025 mm) gold wire. Stage temperature: 220 C to 250 C; Bond Tip Temperature: 150 C; Bond Force:
20 to 30 gms depending on size of wire and Bond Tip Temperature.
HANDLING PRECAUTIONS: The user must operate in a clean, dry environment. Care should be exercised
during handling avoid damage to the devices. Electrostatic Discharge (ESD) precautions should be observed at all
stages of storage, handling, assembly, and testing. The static discharge must be less than 300V.
TRANSCOM, INC.,
Web-Site:
Lg
www.transcominc.com.tw
Rg
Cgs
Ri
90 Dasoong 7
Cgd
Rs
T
Ls
Gm
th
Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Cds
DS
= 8 V, I
Phone: [phone]
Rds
DS
Rd
= 1200 mA
Ld
4 / 4
PARAMETERS
Cgd
Cgs
Gm
Rg
Lg
Ri
T
Fax: [phone]
0.008 nH
0.093 Ohm
0.185 Ohm
0.803 pF
2335 mS
22.9 pF
3.9 psec
5 C; Handling Tool: Tweezers;
Cds
Rds
Rd
Ld
Rs
Ls
REV4_20070502
TC1806
0.0014 nH
0.106 Ohm
0.001 nH
2.977 pF
0.14 Ohm
11.9 Ohm