ssc-gr101 Seoul Semiconductor, ssc-gr101 Datasheet - Page 4

• Manufacturer Part Number: ssc-gr101
• Description: Chip Device Led
• Manufacturer: Seoul Semiconductor

SSC-QP-0401-06(REV.1)
5. Soldering Profile
(1) Lead Solder
(2) Lead-Free Solder
(3) Hand Soldering conditions
[Note] In case the soldered products are reused in soldering process, we don’t guarantee the products.
Reflow Soldering Conditions/ Profile
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 240℃max. for 5 seconds max.
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 260℃max. for 10 seconds max.
-Not more than 3 seconds @MAX280℃, under Soldering iron.
260
150
120
240
150
120
°C
°C
0
0
Pre-heating
Pre-heating
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: [phone] FAX: [phone]
60 to 120 sec.
60 to 120 sec.
SEOUL SEMICONDUCTOR CO,. LTD.
Temperature
rise: 5°C/sec.
Temperature
rise: 5°C/sec.
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Operation heating
Operation heating
5sec. max
10 sec.
-5°C/sec.
-5°C/sec.
Cooling:
Cooling:
SSC-GR101