25c040xt Microchip Technology Inc., 25c040xt Datasheet - Page 15

• Manufacturer Part Number: 25c040xt
• Description: 4k Spi Bus Serial Eeprom
• Manufacturer: Microchip Technology Inc.

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
© 2006 Microchip Technology Inc.
*Controlling Parameter
Notes:
1. Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Drawing No. C04-086
c
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
b
e
.005" (0.127mm) per side.
See ASME Y14.5M
See ASME Y14.5M
n
Dimension Limits
E1
E
Units
A2
A1
E1
A
E
D
n
e
L
c
b
MIN
L
25AA040/25LC040/25C040
.031
.002
.169
.018
.004
.007
.114
0°
–
Note:
INCHES
.026 BSC
.252 BSC
12° REF
12° REF
NOM
2
1
.039
.173
.024
.118
D
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8
–
–
–
–
–
MAX
.047
.041
.006
.177
.122
.030
.008
.012
8°
A1
A
MIN
0.80
0.05
4.30
2.90
0.45
0.09
0.19
0°
–
MILLIMETERS*
6.40 BSC
0.65 BSC
12° REF
12° REF
NOM
1.00
4.40
3.00
0.60
Revised 7-25-06
8
–
–
–
–
–
DS21204E-page 15
MAX
A2
1.20
1.05
0.15
4.50
3.10
0.75
0.20
0.30
8°