efm32g890 ETC-unknow, efm32g890 Datasheet - Page 59

• Manufacturer Part Number: efm32g890
• Description: Ic Microcontroller
• Manufacturer: ETC-unknow

5.2 Soldering Information
2010-12-17 - d0010_Rev1.20
Figure 5.3. BGA112 PCB Stencil Design
1. The drawings are not to scale.
2. All dimensions are in millimeters.
3. All drawings are subject to change without notice.
4. The PCB Land Pattern drawing is in compliance with IPC-7351B.
5. Stencil thickness 0.125 mm.
The latest IPC/JEDEC J-STD-020 recommendations for Pb-Free reflow soldering should be followed.
The packages have a Moisture Sensitivity Level rating of 3, please see the latest IPC/JEDEC J-STD-033
standard for MSL description and level 3 bake conditions.
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