SST12LF02 Microchip Technology Inc., SST12LF02 Datasheet

SST12LF02

Manufacturer Part Number

SST12LF02

Description

2.4 Ghz High-gain, High-efficiency Front-end Module

Manufacturer

Microchip Technology Inc.

Datasheet

1.SST12LF02.pdf (2 pages)

Current page: 1 of 2
Download datasheet (234Kb)

A Microchip Technology Company

Features

• High Gain:

• High linear output power (at 3.3V):

• High power-added efficiency/Low operating cur-

• High temperature stability

• Temperature and load insensitive on-chip power detector

• Low insertion loss

• Input/output ports matched to 50 internally and

• Packages available

• All non-Pb (lead-free) devices are RoHS compliant

Applications

• WLAN (IEEE 802.11b/g/n)

• Bluetooth™

• Home RF

• Cordless phones

• 2.4 GHz ISM wireless equipment

rent for 802.11b/g/n applications

DC decoupled.

– Typically 29 dB gain across 2.4–2.5 GHz over tempera-

– Meets 802.11g OFDM ACPR requirement up to 21 dBm

– <3% added EVM up to 18 dBm for

– Meets 802.11b ACPR requirement up to 21 dBm

– ~1 dB power variation between -20°C to +85°C

– ~3 dB gain variation between -20°C to +85°C

– 20 dB dynamic range

– 0.5 dB for WLAN receiver and Bluetooth ports

– 4.5 dB and 3.8 dB for simultaneous WLAN and Blue-

– 16-contact XQFN – 3mm x 3mm x 0.45mm

ture -20°C to +85°C for Transmitter (TX) chain.

54 Mbps 802.11g signal

tooth receiver ports, respectively

2.4 GHz High-Gain, High-Efficiency Front-end Module

The SST12LF02 is a 2.4 GHz Front-End Module (FEM) that combines a high-perfor-

mance Power Amplifier (PA) and a switch within a compact, fully-matched package.

Designed in compliance with IEEE 802.11b/g/n applications and based on GaAs

PHEMT/HBT technology, the SST12LF02 operates within the frequency range of 2.4-

2.5 GHz with very low DC-current consumption. The Transmitter chain has excellent

linearity, typically <3% added EVM up to 18 dBm output power, with 802.11g 54 Mbps

OFDM operation while meeting 802.11b/g/n spectrum mask at 21 dBm. An option to

simultaneously connect the WLAN and Bluetooth receiver ports is available. The

SST12LF02 is offered in a 16-contact XQFN package.

www.microchip.com

Block Diagram

Product Ordering

Valid combinations for SST12LF02

SST12LF02 Evaluation Kits

Note: Valid combinations are those products in mass produc-

Bluetooth

Rx_out

Tx_in

SST12LF02-QXCE

SST12LF02-QXCE-K

tion or will be in mass production. Consult your SST sales

representative to confirm availability of valid combinations

and to determine availability of new combinations.

Tx Input

Match

Vccb

Circuit

Bias

Vref

Vcc

SST12LF02

Vdet

Switch

SP3T

DS75006B

Product Brief

Antenna

06/11

Related parts for SST12LF02

SST12LF02 Summary of contents

Page 1

... GHz High-Gain, High-Efficiency Front-end Module A Microchip Technology Company The SST12LF02 is a 2.4 GHz Front-End Module (FEM) that combines a high-perfor- mance Power Amplifier (PA) and a switch within a compact, fully-matched package. Designed in compliance with IEEE 802.11b/g/n applications and based on GaAs PHEMT/HBT technology, the SST12LF02 operates within the frequency range of 2.4- 2.5 GHz with very low DC-current consumption. The Transmitter chain has excellent linearity, typically < ...

Page 2

... Silicon Storage Technology, Inc. Description Initial release of Product Brief Added Contact Information Modified summary paragraph on page 1. Added “Insertion loss” information to Features on page 1. Silicon Storage Technology, Inc. A Microchip Technology Company www.microchip.com 2 SST12LF02 Product Brief Date Apr 2011 Jun 2011 DS75006B 06/11 ...

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