S10604 Hamamatsu Photonics, K.K.,, S10604 Datasheet - Page 3

• Manufacturer Part Number: S10604
• Description: Photo Ics
• Manufacturer: Hamamatsu Photonics, K.K.,

INDEX MARK
· After unpacking, store this device in an environment at a temperature of 5 to 25 °C and a humidity below 60 %, and perform
· Thermal stress applied to the device during reflow soldering differs depending on the PC boards and reflow oven being used.
THE DRAWING SURROUNDED
BY THE DOTTED LINE SHOWS
A SCHEMATIC DIAGRAM OF
THE PHOTO IC.
reflow soldering on this device within 168 hours (7 days).
When setting the reflow conditions, make sure that the reflow soldering process does not degrade device reliability.
Operating circuit example
Dimensional outline (unit: mm)
Recommended solder reflow condition
300
250
200
150
100
50
0
0.4
0
(0.25)
PEAK TEMPERATURE 260 ˚C MAX.
2.0
1.4
50
PHOTODIODE
FOR SIGNAL OFFSET
PREHEAT TIME
(150 TO 200 ˚C)
100
0.4
CURRENT AMP
(APPROX. 30000 times)
160 s
150
ACTIVE AREA
0.32 × 0.46
Tolerance unless otherwise
noted: ± 0.2
Values in parentheses indicate
reference value
TIME (s)
CATHODE
ANODE
200
CATHODE
ANODE
Electrode
C
L
SOLDERING
(217 ˚C MIN.)
250
100 s
TIME
R
L
Vout
300
PHOTODIODE
FOR SIGNAL DETECTION
350
INTERNAL PROTECTION
RESISTANCE
(APPROX. 150
1.0
RECOMMENDED
REVERSE BIAS
POWER SUPPLY
LAND PATTERN
400
KPICB0119EA
1.0
KPICC0132EA
9
)
1.0
KPICA0072EA
The photo IC diode must be reverse-biased so that a positive
potential is applied to the cathode.
To eliminate high-frequency components, we recommend plac-
ing a load capacitance C
a low-pass filter.
Cut-off frequency fc
CATHODE
Packing specifications
ANODE
1.5
2
2.2
Tape (3000 pcs./reel)
2 C
L
1
Photo IC diode
L
in parallel with load resistance R
4
R
L
Reel
13
9
10
S10604
0.23
KPICA0073EA
KPICA0074EA
L
as
3