ltl911syksa-l LiteOn Technology Corp., ltl911syksa-l Datasheet - Page 9
![no-image](/images/no-image-200.jpg)
ltl911syksa-l
Manufacturer Part Number
ltl911syksa-l
Description
Thru-hole Led Lamps Super Flux Allngap Yellow Ltl911syksa-l
Manufacturer
LiteOn Technology Corp.
Datasheet
1.LTL911SYKSA-L.pdf
(12 pages)
1. Application
2. Storage
3. Cleaning
4. Lead Forming & Assembly
5. Soldering
Part No. : LTL911SYKSA-L
BNS-OD-C131/A4
Dipping the lens into the solder must be avoided.
Do not apply any external stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering conditions :
humidity. It is recommended that LEDs out of their original packaging are used within 168 hours
(7days). For extended storage out of their original packaging, it must be stored in a sealed container
with appropriate desiccant or in desiccators with nitrogen ambient.
environments which contain corrosive substances. Please avoid conditions which may cause the
LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during
soldering operations. It is recommended that the LEDs be used as soon as possible.
where condensation can occur.
lens. Do not use the base of the lead frame as a fulcrum during forming. Lead forming must be
done before soldering, at normal temperature. During assembly on PCB, use minimum clinch
force possible to avoid excessive mechanical stress.
equipment, communication equipment and household applications).Consult Liteon’s Sales in advance for
information on applications in which exceptional reliability is required, particularly when the failure or
malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic
control equipment, medical and life support systems and safety devices).
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic
Liteon leadframes are copper alloy with silver plated. The silver surface may be affected by
Please avoid rapid transitions in ambient temperature, especially, in high humidity environment
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative
During lead forming, the leads should be bent at a point at least 3mm from the base of LED
The LEDs described here are intended to be used for ordinary electronic equipment (such as office
When soldering, leave a minimum of 2.0mm clearance from the base of the lens to the soldering point.
failure of the LED. IR re-flow is not suitable process for through whole type Piranha LED production.
Temperature
Soldering time
Soldering iron
LITE-ON TECHNOLOGY CORPORATION
300°C Max.
3 sec. Max.
(one time only)
P r o p e r t y o f L i t e - O n O n l y
CAUTIONS
Pre-heat
Pre-heat time
Solder wave
Soldering time
Wave soldering
100°C Max.
60 sec. Max.
260°C Max.
5 sec. Max.
Page :
9
of
12