as1369-bwlt-50 austriamicrosystems, as1369-bwlt-50 Datasheet - Page 3

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as1369-bwlt-50

Manufacturer Part Number
as1369-bwlt-50
Description
200ma Micro-sized Ultra Low Dropout Regulator
Manufacturer
austriamicrosystems
Datasheet
AS1369
Data Sheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
and functional operation of the device at these or any other conditions beyond those indicated in
istics on page 4
device reliability.
Table 2. Absolute Maximum Ratings
1. The output PNP structure contains a diode between pins V
2. The maximum allowable power dissipation is a function of the maximum junction temperature (T
The AS1369 uses an internal protective structure against light influence. However, exposing the WLP package to
direct light could cause device malfunction.
www.austriamicrosystems.com
ing the polarity of pins V
junction-to-ambient thermal resistance (Θ
power dissipation at any ambient temperature is calculated as:
Operating Junction Temperature
Storage Temperature Range
Package Body Temperature
Where:
The value of Θ
Note: Exceeding the maximum allowable dissipation will cause excessive device temperature and the
regulator will go into thermal shutdown.
Shutdown Input Voltage
Input/Output Voltage
Input Supply Voltage
Power Dissipation
Output Voltage
Parameter
Latch-Up
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
ESD
I
OUT
JA
for the WLP package is 345°C/W.
IN
2
and V
1
Table 2
OUT
will activate this diode.
may cause permanent damage to the device. These are stress ratings only,
P
(MAX)
-100
Min
-0.3
-0.3
-0.3
-0.3
-40
-65
JA
), and the ambient temperature (T
= (T
+125
+150
+100
+260
Max
360
500
+7
+7
+7
+7
J(MAX)
2
Revision 1.00
- (T
Units
mW
mA
kV
ºC
ºC
ºC
V
V
V
V
V
IN
AMB
and V
))/
temperature) specified is in accordance with IPC/
JEDEC J-STD-020C “Moisture/Reflow Sensitivity
Θ
The lead finish for Pb-free leaded packages is
The reflow peak soldering temperature (body
JA
OUT
Classification for Non-Hermetic Solid State
HBM MIL-Std. 883E 3015.7 methods
Internally limited. Mounted on PCB.
that is normally reverse-biased. revers-
CDM JESD22-C101C methods
Surface Mount Devices”.
AMB
Short-circuit protected.
matte tin (100% Sn).
). The maximum allowable
Comments
JEDEC 78
Electrical Character-
J(MAX
), the
(EQ 1)
3 - 16

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