c450tr5050-0209 Cree, Inc., c450tr5050-0209 Datasheet - Page 2

• Manufacturer Part Number: c450tr5050-0209
• Manufacturer: Cree, Inc.

Notes:
1. Maximum ratings are package-dependent. The above ratings were determined using lamps in chip-on-MCPCB (metal core PCB)
2. Product resistance to electrostatic discharge (ESD) according to the HBM is measured by simulating ESD using a rapid avalanche
3. All products conform to the listed minimum and maximum specifications for electrical and optical characteristics when assembled
4. The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for
Copyright © 2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the
Cree logo are registered trademarks, and TR and TR5050 are trademarks of Cree, Inc.
2
Maximum Ratings at T
DC Forward Current
Peak Forward Current (1/10 duty cycle @ 1 kHz)
LED Junction Temperature
Reverse Voltage
Operating Temperature Range
Storage Temperature Range
Electrostatic Discharge Threshold (HBM)
Electrostatic Discharge Classification (MIL-STD-883E)
Typical Electrical/Optical Characteristics at T
Part Number
C450TR5050-Sxx000
C460TR5050-Sxx000
Mechanical Specifications
Description
P-N Junction Area (μm)
Chip Area (μm)
Chip Thickness (μm)
Au Bond Pad Diameter Anode (μm)
Au Bond Pad Thicknesses (μm)
Au Bond Pad Diamater Cathode (μm)
Bottom Area (μm)
packages for characterization. Ratings for other packages may differ. Junction temperature should be characterized in a specific
package to determine limitations. Assembly processing temperature must not exceed 325°C (< 5 seconds).
energy test (RAET). The RAET procedures are designed to approximate the maximum ESD ratings shown.
and operated at 120 mA within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values given
are within the range of average values expected by manufacturer in large quantities and are provided for information only. All
measurements were made using lamps in T-1 3/4 packages (with Hysol OS4000 epoxy encapsulant and clear epoxy die attach).
Optical characteristics measured in an integrating sphere using Illuminance E.
the end-product to be designed in a manner that minimizes the thermal resistance from the LED junction to ambient in order to
optimize product performance.
CPR3ER Rev. -
Note 4
A
= 25°C
Notes 1&3
Min.
Note 2
2.7
2.7
Forward Voltage (V
A
= 25°C, If = 120 mA
Typ.
Note 2
3.3
3.3
f
, V)
Max.
3.5
3.5
Note 3
Reverse Current
[I(Vr=5V), μA]
Max.
2
2
Dimension
426 x 443
500 x 500
327 x 327
175
1.0
90
98
CxxxTR5050-Sxx000
CxxxTR5050-Sxx000
-40°C to +100°C
-40°C to +100°C
Full Width Half Max
180 mA
230 mA
1000 V
Class 2
150°C
5 V
(λ
USA Tel: [phone]
D
Typ.
, nm)
20
21
Tolerance
Durham, NC 27703
4600 Silicon Drive
±0.5
±35
±35
±15
±10
±10
±35
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Cree, Inc.