c450ez700-0221 Cree, Inc., c450ez700-0221 Datasheet

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c450ez700-0221

Manufacturer Part Number
c450ez700-0221
Description
Cree Ez700? Led
Manufacturer
Cree, Inc.
Datasheet
Cree
Data Sheet
CxxxEZ700-Sxx000
Cree’s EZBright™ LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials
with Cree’s proprietary optical design and device technology to deliver superior value for high-intensity LEDs. The
optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern. Additionally, these
LEDs are die attachable with conductive epoxy, solder paste or solder preforms, in addition to using the flux eutectic
method. These vertically structured, low forward voltage LED chips are approximately 100 microns in height. Cree’s
EZ™ chips are tested for conformity to optical and electrical specifications. These LEDs are useful in a broad range of
applications, such as general illumination, automotive lighting and LCD backlighting.
FEATURES
CxxxEZ700-Sxx000 Chip Diagram
EZBright Power Chip LED Rf Performance
Lambertian Radiation
Conductive Epoxy, Solder Paste or Preforms,
or Flux Eutectic Attach
Thin 100 µm Chip
Low Forward Voltage – 3.6 V Typical at 350 mA
Single Wire Bond Structure
Top View
200 mW min. & 260 mW min. – 450 nm
180 mW min. & 240 mW min. – 460 nm
160 mW min. & 220 mW min. – 470 nm
70 mW min. - 527 nm
®
EZ700™ LED
Gold Bond Pad
130 x 130 µm
EZBright LED Chip
680 x 680 µm
Backside
Metallization
Subject to change without notice.
www.cree.com
Bottom View
APPLICATIONS
General Illumination
White LEDs
Crosswalk Signals
Backlighting
Automotive
Aircraft
Decorative Lighting
Task Lighting
Outdoor Illumination
t = 100 µm
Die Cross Section
Anode (+);
3 µm AuSn
Cathode (-)


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c450ez700-0221 Summary of contents

Page 1

Cree EZ700™ LED ® Data Sheet CxxxEZ700-Sxx000 Cree’s EZBright™ LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary optical design and device technology to deliver superior value for high-intensity LEDs. The ...

Page 2

... Note  A DC Forward Current Peak Forward Current LED Junction Temperature Reverse Voltage Operating Temperature Range Storage Temperature Range Typical Electrical/Optical Characteristics at T Part Number Forward Voltage (V Min. C450EZ700-Sxx000 3.0 C460EZ700-Sxx000 3.0 C470EZ700-Sxx000 3.0 C527EZ700-Sxx000 3.2 Mechanical Specifications Description P-N Junction Area (μm) Chip Area (μm) Chip Thickness (μm) Top Au Bond Pad (μ ...

Page 3

... Sorted die kit (CxxxEZ700-Sxx000) orders may be filled with any or all bins (CxxxEZ700-0xxx) contained in the kit. All radiant flux and all dominant wavelength values shown and specified are 350 mA. Radiant flux values are measured using Au-plated TO39 headers without an encapsulant. 300 mW C450EZ700-0221 280 mW C450EZ700-0217 260 mW 445 nm 447 ...

Page 4

... C527EZ700-0204 90 mW C527EZ700-0201 70 mW 520 nm Copyright © 2006-2008 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks, and EZBright, EZ, and EZ700 are trademarks of Cree, Inc. 4 CPR3DF Rev. A C470EZ700-S000 ...

Page 5

... Color==527 Smoothing Spline Fit, lambda=100 Color==527 Copyright © 2006-2008 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks, and EZBright, EZ, and EZ700 are trademarks of Cree, Inc. ...

Page 6

... This is a representative radiation pattern for the EZBright Power Chip LED product. Actual patterns will vary slightly for each chip. Copyright © 2006-2008 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks, and EZBright, EZ, and EZ700 are trademarks of Cree, Inc. ...

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