ltc3872ets8-trpbf Linear Technology Corporation, ltc3872ets8-trpbf Datasheet - Page 18

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ltc3872ets8-trpbf

Manufacturer Part Number
ltc3872ets8-trpbf
Description
No Rsense Current Mode Boost Dc/dc Controller
Manufacturer
Linear Technology Corporation
Datasheet
LTC3872
PACKAGE DESCRIPTIO
18
2.55 ±0.05
(SEE NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.15 ±0.05
TOP MARK
PIN 1 BAR
0.25 ± 0.05
0.61 ±0.05
(2 SIDES)
0.200 REF
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
U
3.00 ±0.10
2.20 ±0.05
(2 SIDES)
(2 SIDES)
(Reference LTC DWG # 05-08-1702 Rev B)
0.50 BSC
8-Lead Plastic DFN (3mm × 2mm)
2.00 ±0.10
0.75 ±0.05
(2 SIDES)
0.70 ±0.05
DDB Package
PACKAGE
OUTLINE
0 – 0.05
R = 0.05
0.56 ± 0.05
(2 SIDES)
TYP
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
R = 0.115
TYP
4
5
2.15 ±0.05
(2 SIDES)
8
1
0.50 BSC
0.40 ± 0.10
PIN 1
R = 0.20 OR
0.25 × 45°
CHAMFER
(DDB8) DFN 0905 REV B
3872fa

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