ltc3108-1 Linear Technology Corporation, ltc3108-1 Datasheet - Page 22

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ltc3108-1

Manufacturer Part Number
ltc3108-1
Description
Ltc3108-1 Ultralow Voltage Step-up Converter And Power Manager Features
Manufacturer
Linear Technology Corporation
Datasheet
LTC3108-1
package DescripTion

3.60 0.05
TOP MARK
2.20 0.05
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
(NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1
0.200 REF
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
1.70 0.05
0.25 0.05
4.00 0.10
3.30 0.05
(2 SIDES)
2.50 REF
12-Lead Plastic DFN (4mm × 3mm)
0.50 BSC
(Reference LTC DWG # 05-08-1695)
0.70 0.05
0.75 0.05
3.00 0.10
(2 SIDES)
UE/DE Package
PACKAGE OUTLINE
0.00 – 0.05
R = 0.05
TYP
BOTTOM VIEW—EXPOSED PAD
1.70 0.10
0.25 0.05
6
7
R = 0.115
3.30 0.10
2.50 REF
TYP
0.50 BSC
12
1
0.40 0.10
PIN 1 NOTCH
R = 0.20 OR
0.35 45
CHAMFER
(UE12/DE12) DFN 0806 REV D
31081f

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