ltc6244hv Linear Technology Corporation, ltc6244hv Datasheet - Page 22

• Manufacturer Part Number: ltc6244hv
• Description: Dual 50mhz, Low Noise, Rail-to-rail, Cmos Op Amp
• Manufacturer: Linear Technology Corporation

PACKAGE DESCRIPTIO
LTC6244
22
3.5 ±0.05
2.15 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
1.65 ±0.05
(2 SIDES)
(NOTE 6)
0.25 ± 0.05
PIN 1
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
U
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
2.38 ±0.05
(2 SIDES)
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.50
BSC
DD Package
0.675 ±0.05
0.75 ±0.05
3.00 ±0.10
(4 SIDES)
PACKAGE
OUTLINE
0.00 – 0.05
1.65 ± 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
R = 0.115
TYP
4
5
2.38 ±0.10
(2 SIDES)
8
1
0.50 BSC
0.38 ± 0.10
(DD8) DFN 1203
6244f