ltc5590 Linear Technology Corporation, ltc5590 Datasheet - Page 19

• Manufacturer Part Number: ltc5590
• Description: Dual 600mhz To 1.7ghz High Dynamic Range Downconverting Mixer
• Manufacturer: Linear Technology Corporation

PACKAGE DESCRIPTION
Please refer to
5.40 0.05
3.90 0.05
3.25 REF
5.00 0.10
http://www.linear.com/designtools/packaging/
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD LAYOUT
PIN 1
TOP MARK
(NOTE 6)
3.20 0.05
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
5.00 0.10
3.20 0.05
(Reference LTC DWG # 05-08-1747 Rev A)
24-Lead Plastic QFN (5mm × 5mm)
0.65 BSC
0.30 0.05
0.75 0.05
UH Package
PACKAGE OUTLINE
for the most recent package drawings.
0.75 0.05
0.00 – 0.05
0.200 REF
3.25 REF
R = 0.05
TYP
BOTTOM VIEW—EXPOSED PAD
R = 0.150
3.20 0.10
TYP
3.20 0.10
23
24
0.65 BSC
LTC5590
0.30 0.05
OR 0.35 45
PIN 1 NOTCH
R = 0.30 TYP
CHAMFER
(UH24) QFN 0708 REV A
1
2
0.55 0.10
19
5590f