mma-022030b MicroWave Technology, Inc., mma-022030b Datasheet - Page 4

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mma-022030b

Manufacturer Part Number
mma-022030b
Description
+29dbm Power Amplifier
Manufacturer
MicroWave Technology, Inc.
Datasheet
Bonding/Assembly Recommendations:
1. Use epoxy with good thermal and electrical conductivity to attach the device. Curing temperature should
2. Use 1.0 mil diameter Au wire, 2 parallel each pad for RF input and output pads. Keep the wire length less than 10
maintain at approximately +150 °C.
mils to minimize its impact to high frequency performance.
MMA-022030B Bonding/Assembly Diagram
Please visit MwT website
MicroWave Technology, Inc., an IXYS Company, 4268 Solar Way, Fremont, CA 94538
Data contained herein is subject to change without notice. All rights reserved © 2007
510-651-6700
www.mwtinc.com
Updated 5/29/2007, Page 4 of 4
FAX
510-651-2208
for information on other MwT MMIC products.
WEB
www.mwtinc.com
MMA-022030B
+29dBm Power Amplifier
2 - 20 GHz GaAs MMIC
March 2007
Data Sheet

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