upc2723t ETC-unknow, upc2723t Datasheet - Page 11

• Manufacturer Part Number: upc2723t
• Description: Amplifier Tuner Mobile Telephone
• Manufacturer: ETC-unknow

Note 1. The combined use of soldering method is to be avoided (However, except the pin area heating method).
NOTE ON CORRECT USE
RECOMMENDED SOLDERING CONDITIONS
the recommended conditions are to be consulted with our sales representatives.
Infrared ray reflow
VPS
Wave soldering
Pin part heating
PC2723T
This product should be soldered in the following recommended conditions. Other soldering methods and conditions than
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 1 000 pF) to the V
Soldering method
*: It is the storage days after opening a dry pack, the storage conditions are 25 C, less than 65 % RH.
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (IEI-1207).
Package peak temperature: 235 C,
Hour: within 30 s. (more than 210 C),
Time: 2 times, Limited days: no.*
Package peak temperature: 215 C,
Hour: within 40 s. (more than 200 C),
Time: 2 times, Limited days: no.*
Soldering tub temperature: less than 260 C,
Hour: within 10 s.
Time: 1 time, Limited days: no.
Pin area temperature: less than 300 C,
Hour: within 3 s/pin.
Limited days: no.*
Soldering conditions
CC
pin.
condition symbol
Recommended
WS60–00-1
VP15–00-2
IR35–00-2
PC2723T
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