upc1663gv-e1 Renesas Electronics Corporation., upc1663gv-e1 Datasheet - Page 12

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upc1663gv-e1

Manufacturer Part Number
upc1663gv-e1
Description
Dc To Vhf Wideband Differential Input And Output Amplifier Ic
Manufacturer
Renesas Electronics Corporation.
Datasheet

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RECOMMENDED SOLDERING CONDITIONS
conditions other than those recommended below, contact your NEC sales representative.
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E)
12
Infrared Reflow
VPS
Wave Soldering
Partial Heating
This product should be soldered under the following recommended conditions.
Note After opening the dry pack, keep it in a place below 25 C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
Soldering Method
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit: None
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit: None
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit: None
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit: None
Soldering Conditions
Data Sheet G11024EJ6V0DS00
Note
Note
Note
Note
Recommended Condition Symbol
For soldering methods and
WS60-00-1
VP15-00-3
IR35-00-3
PC1663

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