upc8220t5a Renesas Electronics Corporation., upc8220t5a Datasheet
upc8220t5a
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upc8220t5a Summary of contents
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Tx AND Rx MCP IC FOR 1.9 GHz PHS DESCRIPTION µ The PC8220T5A is MCP (Multi Chip Packaging) IC consisted of silicon germanium (SiGe) bipolar process and LDMOS designed for use as transmitting and receiving for 1.9 GHz PHS. This ...
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PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View Block NOTE ON CORRECT USE Exposed heatsink at bottom on package that is combined with GND (ground) must be soldered to PCB RF/DC ...
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RECOMMENDED OPERATING RANGE (T Parameter Symbol LNA Output Voltage V LNAout Mixer Output Voltage Driver Output Voltage Drain-Source Voltage V PA Gate-Source Voltage V Operating Ambient Temperature T RF Input Frequency ...
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ELECTRICAL CHARACTERISTICS − Tx Block − +25° Parameter Symbol Threshold Voltage V Gate-Source Voltage V Circuit Current (DRV + PA) Input Return Loss RL Output Return Loss RL Output Power P Power ...
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EVALUATION CIRCUIT ( 0.5 pF 1.0 pF 4.7 nH 0 100 3 1.5 pF 1 OUT 1 100 ...
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TYPICAL CHARACTERISTICS (T − Tx Block − 3 1.9 GHz OUTPUT POWER, ADJACENT CHANNEL POWER vs. INPUT POWER 25 P out 20 15 –600 +600 10 –30 –25 –20 Input ...
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Rx Block − 3 1.90 GHz RF1 f = 1.66 GHz) Lo CONVERTION GAIN vs. LOCAL INPUT POWER –19 –17 –15 –13 Local Input Power P (dBm) Loin ...
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PACKAGE DIMENSIONS 16-PIN PLASTIC TSON (UNIT: mm) 3.5±0.15 3.3±0.1 0.16±0.05 Remark ( ) : Reference value 8 0.4±0.05 (Bottom View) (0.55) (2.2) Data Sheet PU10532EJ01V0DS µ PC8220T5A ...
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RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Peak temperature (package surface temperature) Time at peak ...
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The information in this document is current as of November, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date ...
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For further information, please contact NEC Compound Semiconductor Devices, Ltd. E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) Hong Kong Head Office ...