mt46h32m32lfcm Micron Semiconductor Products, mt46h32m32lfcm Datasheet - Page 3
mt46h32m32lfcm
Manufacturer Part Number
mt46h32m32lfcm
Description
1gb X16, X32 Mobile Ddr Sdram At Addendum
Manufacturer
Micron Semiconductor Products
Datasheet
1.MT46H32M32LFCM.pdf
(4 pages)
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Electrical Specifications
Table 3:
Table 4:
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although
PDF: 09005aef82c1aa70/Source: 09005aef82c1a99b
1gb_ddr_mobile_sdram_t48m_AT_addendum__2.fm - Rev. B 05/08 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respec-
Parameter/Condition
Parameter
Precharge power-down standby current: All banks idle; CKE is
LOW; CS is HIGH;
switching; Data bus inputs are stable
Precharge power-down standby current: Clock stopped; All
banks idle; CKE is LOW; CS is HIGH; CK = LOW, CK# = HIGH; Address
and control inputs are switching; Data bus inputs are stable
Precharge nonpower-down standby current: Clock stopped;
All banks idle; CKE = HIGH; CS = HIGH; CK = LOW, CK# = HIGH;
Address and control inputs are switching; Data bus inputs are
stable
Active power-down standby current: One bank active;
CKE = LOW; CS = HIGH;
are switching; Data bus inputs are stable
Active power-down standby current: Clock stopped; One bank
active; CKE = LOW; CS = HIGH; CK = LOW; CK# = HIGH; Address and
control inputs are switching; Data bus inputs are stable
Auto refresh: Burst refresh; CKE = HIGH;
Address and control inputs are switching; Data
bus inputs are stable
Refresh period
Average periodic refresh interval
considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.
I
Refer to the standard product data sheet for applicable notes; V
Electrical Characteristics and Recommended AC Operating Conditions
Refer to the standard product data sheet for applicable notes; V
temperature
DD
t
Specifications and Conditions (x16/x32)
CK =
t
t
CK (MIN); Address and control inputs are
CK =
prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992
≤
+105°C
t
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
CK (MIN); Address and control inputs
Symbol
t
t
REFI
REF
Min
t
–
–
RFC =
-5
1Gb: x16, x32 Mobile DDR SDRAM AT Addendum
Max
1.95
tive owners.
t
16
REFI
3
Min
–
–
-54
Symbol
I
I
I
DD
I
Micron Technology, Inc., reserves the right to change products or specifications without notice.
I
DD
I
DD
DD
DD
DD
Max
1.95
16
2NS
2PS
3PS
5A
2P
3P
DD
DD
Min
28
16
/V
-5
/V
–
–
DD
DD
-6
Q = 1.70–1.95V
Q = 1.70–1.95V; +85°C
Max
1.95
-54
16
26
16
Electrical Specifications
1,200
1,200
Max
4.6
4.6
Min
©2007 Micron Technology, Inc. All rights reserved.
25
16
-6
–
–
-75
Max
1.95
-75
20
15
16
≤
Unit Notes
Unit Notes
operating
mA
mA
mA
mA
µA
µA
ms
µs
10, 11
7, 8
22
7
9
8