mt46h32m32lfjg-5 Micron Semiconductor Products, mt46h32m32lfjg-5 Datasheet - Page 11

• Manufacturer Part Number: mt46h32m32lfjg-5
• Description: 168-ball X16, X32 Mobile Lpddr Pop Ti Omap Mobile Ddr Sdram Addendum
• Manufacturer: Micron Semiconductor Products

Package Dimensions
Figure 7:
PDF: 09005aef833508fb/Source: 09005aef83350d72
ddr_mobile_sdram_only_168b_pop.fm - Rev. B 01/09 EN
Dimensions apply
to solder balls post-
reflow. Pre-reflow
ball is Ø0.3 on Ø0.27
SMD ball pads.
168X Ø0.326
Preliminary: This data sheet contains initial characterization limits that are subject to change upon full characterization of production
Seating
plane
0.08 A
11
0.5 TYP
5.5
168-Ball VFBGA
A
Notes:
23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
5.5
1. All dimensions are in millimeters.
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12 ±0.15
11
168-Ball x16, x32 Mobile LPDDR PoP (TI OMAP)Mobile DDR
Ball A1 ID
6 ±0.08
TYP
0.5
devices.
11
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
6 ±0.08
0.6 ±0.05
12 ±0.15
Micron Technology, Inc., reserves the right to change products or specifications without notice.
0.9 MAX
Solder ball material:
Substrate material:
Mold compound: epoxy novolac
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
plastic laminate with OSP finish
Ball A1 ID
©2008 Micron Technology, Inc. All rights reserved.
SDRAM Addendum
Preliminary