mt4lc4m16r6 Micron Semiconductor Products, mt4lc4m16r6 Datasheet - Page 3

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mt4lc4m16r6

Manufacturer Part Number
mt4lc4m16r6
Description
4 Meg X 16 Edo Dram
Manufacturer
Micron Semiconductor Products
Datasheet

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GENERAL DESCRIPTION
dynamic random-access memory device containing
67,108,864 bits and designed to operate from 3V to
3.6V. The device is functionally organized as 4,194,304
locations containing 16 bits each. The 4,194,304
memory locations are arranged in 4,096 rows by 1,024
columns on the MT4LC4M16R6 or 8,192 rows by 512
columns on the MT4LC4M16N3. During READ or WRITE
cycles, each location is uniquely addressed via the
address bits: 12 row-address bits (A0-A11) and 10
column-address bits (A0-A9) on the MT4LC4M16R6 or
13 row-address bits (A0-A12) and 9 column-address bits
(A0-A8) on the MT4LC4M16N3 version. In addition,
both byte and word accesses are supported via the two
CAS# pins (CASL# and CASH#).
dress and control functions (e.g., latching column
addresses or selecting CBR REFRESH) is such that the
internal CAS# signal is determined by the first external
CAS# signal (CASL# or CASH#) to transition LOW and
4 Meg x 16 EDO DRAM
D29_2.p65 – Rev. 5/00
The 4 Meg x 16 DRAM is a high-speed CMOS,
The CAS# functionality and timing related to ad-
LOWER BYTE
UPPER BYTE
(DQ8-DQ15)
(DQ0-DQ7)
OF WORD
OF WORD
CASH#
CASL#
RAS#
WE#
STORED
X = NOT EFFECTIVE (DON'T CARE)
DATA
1
1
0
1
1
1
1
1
0
1
0
1
0
0
0
0
WORD and BYTE WRITE Example
INPUT
DATA
0
0
1
0
0
0
0
0
X
X
X
X
X
X
X
X
ADDRESS 0
WORD WRITE
INPUT
DATA
1
0
1
0
1
1
1
1
Figure 1
STORED
DATA
0
0
1
0
0
0
0
0
1
0
1
0
1
1
1
1
3
STORED
the last to transition back HIGH. The CAS# functional-
ity and timing related to driving or latching data is such
that each CAS# signal independently controls the asso-
ciated eight DQ pins.
the column address is latched by CAS#. This device
provides EDO-PAGE-MODE operation, allowing for fast
successive data operations (READ, WRITE or READ-
MODIFY-WRITE) within a given row.
cally in order to retain stored data.
DRAM ACCESS
as mentioned in the General Description. Use of both
CAS# signals results in a word access via the 16 I/O pins
(DQ0-DQ15). Using only one of the two signals results
in a BYTE access cycle. CASL# transitioning LOW se-
lects an access cycle for the lower byte (DQ0-DQ7), and
CASH# transitioning LOW selects an access cycle for
DATA
0
0
1
0
0
0
0
0
1
0
1
0
1
1
1
1
The row address is latched by the RAS# signal, then
The 4 Meg x 16 DRAM must be refreshed periodi-
Each location in the DRAM is uniquely addressable,
Micron Technology, Inc., reserves the right to change products or specifications without notice.
LOWER BYTE WRITE
INPUT
DATA
ADDRESS 1
1
1
0
1
1
1
1
1
X
X
X
X
X
X
X
X
INPUT
DATA
STORED
DATA
1
0
1
0
1
1
1
1
1
1
0
1
1
1
1
1
4 MEG x 16
EDO DRAM
©2000, Micron Technology, Inc.

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