mc10el11 ON Semiconductor, mc10el11 Datasheet
mc10el11
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mc10el11 Summary of contents
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... MC10EL11, MC100EL11 5.0 V ECL 1:2 Differential Fanout Buffer The MC10EL/100EL11 is a differential 1:2 fanout buffer. The device is functionally similar to the E111 device but with higher performance capabilities. The within-device skew and propagation delay is significantly improved over the E111. The differential inputs of the EL11 employ clamping circuitry to maintain stability under open input conditions ...
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Table 2. ATTRIBUTES Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Flammability Rating Transistor Count Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see ...
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Table 4. 10EL SERIES PECL DC CHARACTERISTICS Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note Output LOW Voltage (Note Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended) IL ...
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Table 6. 100EL SERIES PECL DC CHARACTERISTICS Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note 10 Output LOW Voltage (Note 10 Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended) IL ...
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Table 8. AC CHARACTERISTICS V CC Symbol Characteristic f Maximum Toggle Frequency max t Propagation Delay to Output PLH t PHL t Within-Device Skew (Note 16) SKEW Duty Cycle Skew (Note 17) t Random Clock Jitter (RMS) JITTER V Input ...
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... ORDERING INFORMATION Device MC10EL11D MC10EL11DG MC10EL11DR2 MC10EL11DR2G MC10EL11DT MC10EL11DTG MC10EL11DTR2 MC10EL11DTR2G MC10EL11MNR4 MC10EL11MNR4G MC100EL11D MC100EL11DG MC100EL11DR2 MC100EL11DR2G MC100EL11DT MC100EL11DTG MC100EL11DTR2 MC100EL11DTR2G MC100EL11MNR4 MC100EL11MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D ...
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... C SEATING PLANE −Z− 0.25 (0.010 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.10 (0.004) ...
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K 8x REF 0.10 (0.004) 0.15 (0.006 L −U− PIN 1 IDENT 0.15 (0.006 −V− C 0.10 (0.004) D −T− G SEATING PLANE PACKAGE DIMENSIONS TSSOP−8 ...
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... COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. MILLIMETERS DIM MIN MAX A 0.80 1.00 A1 0.00 0.05 A3 0.20 REF b 0.20 0.30 D 2.00 BSC D2 1.10 1.30 E 2.00 BSC E2 0.70 0.90 e 0.50 BSC K 0.20 −−− L 0.25 0.35 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MC10EL11/D ...