w83194r-81 Winbond Electronics Corp America, w83194r-81 Datasheet - Page 12

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w83194r-81

Manufacturer Part Number
w83194r-81
Description
100mhz Clock Chipset
Manufacturer
Winbond Electronics Corp America
Datasheet

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9.0 SPECIFICATIONS
9.1 ABSOLUTE MAXIMUM RATINGS
Stresses greater than those listed in this table may cause permanent damage to the device.
Precautions should be taken to avoid application of any voltage higher than the maximum rated
voltages to this circuit. Maximum conditions for extended periods may affect reliability. Unused
inputs must always be tied to an appropriate logic voltage level (Ground or Vdd).
9.2 AC CHARACTERISTICS
Vddq4 = Vdd = Vddq3 = 3.3V
Output Duty Cycle
CPU/SDRAM to PCI Offset
Skew (CPU-CPU), (PCI-
PCI), (SDRAM-SDRAM)
CPU/SDRAM
Cycle to Cycle Jitter
CPU/SDRAM
Absolute Jitter
Jitter Spectrum 20 dB
Bandwidth from Center
Output Rise (0.4V ~ 2.0V)
& Fall (2.0V ~0.4V) Time
Overshoot/Undershoot
Beyond Power Rails
Ring Back Exclusion
Vdd , V
Symbol
Parameter
T
T
T
STG
B
A
IN
Voltage on any pin with respect to GND
Symbol
t
SKEW
BW
V
V
t
t
t
t
OFF
CCJ
t
TLH
THL
5 %, Vddq2=Vddq2b = 2.375V~2.9V , T
RBE
JA
over
J
Operating Temperature
Ambient Temperature
Storage Temperature
Min
0.4
45
1
Parameter
- 12 -
Typ
50
¡Ó250
Max
250
500
500
1.6
1.5
2.1
55
4
Units
Publication Release Date: Dec. 1998
KHz
ns
ps
ps
ps
ns
%
V
V
A
Measured at 1.5V
15 pF Load Measured at 1.5V
15 pF Load Measured at 1.5V
15 pF Load on CPU and PCI
outputs
22
run to 15 pF load
Ring Back must not enter this
range.
= 0 C to +70 C
W83194R-81
at source of 8 inch PCB
Test Conditions
PRELIMINARY
- 0.5 V to + 7.0 V
- 65 C to + 150 C
- 55 C to + 125 C
0 C to + 70 C
Rating
Revision 0.20

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