w83176g-733 Winbond Electronics Corp America, w83176g-733 Datasheet - Page 14

• Manufacturer Part Number: w83176g-733
• Description: Winbond Dual Bank Ddr Buffer For Via Chipset
• Manufacturer: Winbond Electronics Corp America

12. PACKAGE DRAWING AND DIMENSIONS
Please note that all data and specifications are subject to change without notice. All the trade marks
of products and companies mentioned in this data sheet belong to their respective owners.
SEATING PLANE
Y
e
SIDE VIEW
D
TOP VIEW
0.40/0.50 DIA
b
DUAL BANK DDR BUFFER FOR VIA CHIPSET
θ
PARTING LINE
c
.035
.045
A1
E
A2
DETAIL"A"
HE
A
L
L1
.045
.055
SEE DETAIL "A"
END VIEW
θ
- 13 -
c
W83176R-733/W83176G-733
SYMBOL
A2
H
L1
A1
A
c
D
b
E
e
L
Y
θ
E
18.2
9 10.16
7.42
0.51
0.61
0.20
0.20
0.13
2.24
MIN. NOM MAX.
2.41
Publication Release Date: March, 2006
0
DIMENSION IN MM
10.31
7.52
0.30
0.64
0.81
2.29
0.25
18.42
1.40
2.57
18.54
7.59
10.41
0.76
0.08
2.34
0.34
0.25
2.79
0.41
1.02
8
0.008
0.020
0.008
0.088 0.090
0.720
0.400
0.292
0.024
0.005
0.095
DIMENSION IN INCH
MIN.
0
0.012
0.010
0.025
0.055
0.101
0.725
0.032
0.406
0.296
NOM
Revision 1.0
0.0135
0.410
0.299
0.030
0.730
0.040
0.003
0.110
0.092
0.010
0.016
MAX.
8