74hct2g125 NXP Semiconductors, 74hct2g125 Datasheet - Page 12

• Manufacturer Part Number: 74hct2g125
• Description: Dual Buffer/line Driver; 3-state
• Manufacturer: NXP Semiconductors

Philips Semiconductors
PACKAGE OUTLINES
2003 Mar 03
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
Dual buffer/line driver; 3-state
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT505-2
max.
1.1
A
0.15
0.00
A 1
8
1
0.95
0.75
A 2
y
pin 1 index
IEC
e
Z
0.25
A 3
D
0.38
0.22
b p
b p
5
0
0.18
0.08
4
JEDEC
c
- - -
w
REFERENCES
D
3.1
2.9
M
(1)
E
3.1
2.9
(1)
c
JEITA
scale
0.65
12
2.5
e
A
H E
4.1
3.9
A 2
A 1
0.5
L
H E
74HC2G125; 74HCT2G125
E
5 mm
0.47
0.33
detail X
L p
0.2
v
L
L p
PROJECTION
EUROPEAN
0.13
w
A
(A 3 )
0.1
y
X
v
Product specification
M
0.70
0.35
Z
A
(1)
ISSUE DATE
02-01-16
8
0
SOT505-2