74hct2g66 NXP Semiconductors, 74hct2g66 Datasheet - Page 18

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74hct2g66

Manufacturer Part Number
74hct2g66
Description
Bilateral Switches
Manufacturer
NXP Semiconductors
Datasheet

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Philips Semiconductors
PACKAGE OUTLINE
2004 May 19
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
Bilateral switches
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT505-2
max.
1.1
A
0.15
0.00
A 1
8
1
0.95
0.75
A 2
y
pin 1 index
IEC
e
Z
0.25
A 3
D
0.38
0.22
b p
b p
5
0
0.18
0.08
4
JEDEC
c
- - -
w
REFERENCES
D
3.1
2.9
M
(1)
E
3.1
2.9
(1)
c
JEITA
scale
0.65
18
2.5
e
A
H E
4.1
3.9
A 2
A 1
0.5
L
H E
E
5 mm
0.47
0.33
detail X
L p
74HC2G66; 74HCT2G66
0.2
v
L
L p
PROJECTION
EUROPEAN
0.13
w
A
(A 3 )
0.1
y
X
v
M
Product specification
0.70
0.35
Z
A
(1)
ISSUE DATE
02-01-16
8
0
SOT505-2

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