74hct7273 NXP Semiconductors, 74hct7273 Datasheet - Page 16

• Manufacturer Part Number: 74hct7273
• Description: Octal D-type Flip-flop With Reset; Positive Edge-trigger; Open Drain Outputs
• Manufacturer: NXP Semiconductors

Philips Semiconductors
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Oct 01
DBS, DIP, HDIP, SDIP, SIL
Data sheet status
Objective specification
Preliminary specification
Product specification
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Octal D-type flip-flop with reset; positive
edge-trigger; open drain outputs
PACKAGE
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
suitable
DIPPING
16
SOLDERING METHOD
suitable
(1)
WAVE
Product specification
74HCT7273