adf4106-ep Analog Devices, Inc., adf4106-ep Datasheet - Page 10
adf4106-ep
Manufacturer Part Number
adf4106-ep
Description
Pll Frequency Synthesizer Adf4106-ep
Manufacturer
Analog Devices, Inc.
Datasheet
1.ADF4106-EP.pdf
(12 pages)
ADF4106-EP
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADF4106-SRU-EP
ADF4106-SRU-EP-R7
ADF4106-SCPZ-EP
ADF4106-SCPZ-EP-R7
1
Z = RoHS Compliant Part.
1
INDICATOR
SEATING
Temperature Range
−55°C to + 125°C
−55°C to + 125°C
−55°C to + 125°C
−55°C to + 125°C
PLANE
1.00
0.85
0.80
PIN 1
12° MAX
0.15
0.05
4.50
4.40
4.30
PIN 1
Figure 18. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Figure 17. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.65
TOP VIEW
BSC SQ
4.00
16
1
0.80 MAX
0.65 TYP
0.30
0.23
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AB
5.10
5.00
4.90
0.10
4 mm × 4 mm Body, Very Thin Quad
Dimensions shown in millimeters
Dimensions shown in millimeters
Package Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
0.30
0.19
BCS SQ
3.75
0.20 REF
9
8
Rev. A | Page 10 of 12
1.20
MAX
SEATING
PLANE
BSC
6.40
0.05 MAX
0.02 NOM
COPLANARITY
(CP-20-1)
(RU-16)
0.60 MAX
0.08
0.20
0.09
BSC
0.75
0.60
0.50
0.50
0.60 MAX
15
11
8°
0°
16
10
(BOTTOM VIEW)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
EXPOSED
PAD
20
6
1
5
2.25
2.10 SQ
1.95
0.75
0.60
0.45
0.25 MIN
Package Option
RU-16
RU-16
CP-20-1
CP-20-1