mc14049bfel ON Semiconductor, mc14049bfel Datasheet - Page 6

• Manufacturer Part Number: mc14049bfel
• Description: Hex Buffer
• Manufacturer: ON Semiconductor

−T−
16
1
SEATING
PLANE
H
16
1
−A−
G
G
D
0.25 (0.010)
−A−
16 PL
F
D
9
8
16 PL
0.25 (0.010)
M
B
S
T
9
8
K
B
K
C
M
−B−
S
−T−
T
A
A
C
S
MC14049B, MC14050B
P
SEATING
PLANE
PACKAGE DIMENSIONS
M
PLASTIC SOIC PACKAGE
PLASTIC DIP PACKAGE
8 PL
http://onsemi.com
0.25 (0.010)
CASE 751B−05
J
CASE 648−08
D SUFFIX
P SUFFIX
M
SOIC−16
PDIP−16
ISSUE T
ISSUE J
6
M
L
R
B
X 45
S
_
M
J
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
4. DIMENSION B DOES NOT INCLUDE
5. ROUNDED CORNERS OPTIONAL.
ANSI Y14.5M, 1982.
WHEN FORMED PARALLEL.
MOLD FLASH.
DIM
M
A
B
C
D
G
H
K
S
F
J
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
0.740
0.250
0.145
0.015
0.040
0.008
0.295
0.020
0.110
MIN
0.100 BSC
0.050 BSC
Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
0
DIM
INCHES
M
A
B
C
D
F
G
K
P
R
J
_
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
MAX
MILLIMETERS
MIN
0.70
9.80
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
10
1.27 BSC
0
_
_
10.00
18.80
MAX
MILLIMETERS
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
MIN
7
2.54 BSC
1.27 BSC
0
_
_
0.386
0.150
0.054
0.014
0.016
0.008
0.004
0.229
0.010
MIN
19.55
MAX
0.050 BSC
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
0
10
INCHES
_
_
MAX
0.393
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
7
_