e-stlc3095 STMicroelectronics, e-stlc3095 Datasheet - Page 26

• Manufacturer Part Number: e-stlc3095
• Description: Integrated Pots Interface For Home Gateway And Wll
• Manufacturer: STMicroelectronics

Package mechanical data
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Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
Figure 19. TQFP44 (10x10x1.4mm) mechanical data & package dimensions
DIM.
A1
A2
D1
D3
E1
E3
L1
A
B
C
D
E
e
L
k
11.80
11.80
MIN.
0.05
1.35
0.30
0.09
9.80
9.80
0.45
34
44
12.00
10.00
12.00
10.00
TYP.
1.40
0.37
8.00
8.00
0.80
0.60
1.00
mm
0˚(min.), 3.5˚(typ.), 7˚(max.)
33
1
e
MAX.
12.20
10.20
12.20
10.20
1.60
0.15
1.45
0.45
0.20
0.75
D1
D
0.002
0.053
0.012
0.004
0.464
0.386
0.464
0.386
0.018
MIN.
0.055
0.015
0.472
0.394
0.315
0.472
0.394
0.315
0.031
0.024
0.039
inch
TYP.
TQFP4410
11
23
MAX.
0.063
0.006
0.057
0.018
0.008
0.480
0.401
0.480
0.401
0.030
12
22
TQFP44 (10 x 10 x 1.4mm)
MECHANICAL DATA
OUTLINE AND
K
Seating Plane
0.10mm
.004
A1
C
A2
A
0076922 D
STLC3095