hi3-0539-5 Intersil Corporation, hi3-0539-5 Datasheet - Page 11

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hi3-0539-5

Manufacturer Part Number
hi3-0539-5
Description
Precision, 4-channel, Low-level, Differential Multiplexer
Manufacturer
Intersil Corporation
Datasheet
Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
SUBSTRATE POTENTIAL (NOTE):
NOTE: The substrate appears resistive to the -V
conductor at -V
Metallization Mask Layout
92 mils x 100 mils
Type: AlCu
Thickness: 16k
-V
SUPPLY
SUPPLY
Å
±2k
potential.
Å
IN1A
IN2A
11
IN3A
V-
IN4A
EN
SUPPLY
A
0
terminal, therefore it may be left floating (Insulating Die Mount) or it may be mounted on a
OUTA
HI-539
HI-539
PASSIVATION:
WORST CASE CURRENT DENSITY:
TRANSISTOR COUNT:
PROCESS:
Type: Nitride Over Silox
Nitride Thickness: 3.5k
Silox Thickness: 12k
2.54 x 10
236
CMOS-DI
OUTB
A
5
1
A/cm
IN4B
GND
2
at 20mA
Å
IN3B
Å
±2.0k
V+
±1k
Å
IN1B
IN2B
Å

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