cy8cmbr2044 Cypress Semiconductor Corporation., cy8cmbr2044 Datasheet - Page 23

• Manufacturer Part Number: cy8cmbr2044
• Description: Capacitive Button Controllers
• Manufacturer: Cypress Semiconductor Corporation.

Package Information
Thermal Impedances by Package
Solder Reflow Peak Temperature
Package Diagram
Document Number: 001-57451 Rev. *C
Notes
3. TJ = TA + Power x 
4. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5 °C with Sn-Pb or 245 ± 5 °C with Sn-Ag-Cu
paste. Refer to the solder manufacturer specifications.
0.20 DIA TYP.
Package
Package
16 QFN
16 QFN
TOP VIEW
1
2
PART NO.
LG16A
LD16A
Figure 15. 16-Pad Quad Flat No Leads (QFN) No E-pad 3x3 mm Package Outline (Sawn)
JA
3.1
2.9
Minimum Peak Temperature
DESCRIPTION
LEAD-FREE
STANDARD
Typical 
32.7 °C/W
3.1
2.9
240 °C
JA
[3]
0.60 MAX
SIDE VIEW
[4]
0.152 REF.
SEATING PLANE
0.05 MAX
Maximum Peak Temperature
0.20 min
260 °C
1.5 (NOM)
NOTES:
1. JEDEC # MO-220
2. Package Weight: 0.014g
3. DIMENSIONS IN MM, MIN
0.18
0.30
BOTTOM VIEW
1.5
001-09116 *E
0.50
CY8CMBR2044
MAX
1
2
0.45
0.55
Page 23 of 26
PIN #1 ID
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