mc33184dtb ON Semiconductor, mc33184dtb Datasheet - Page 10

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mc33184dtb

Manufacturer Part Number
mc33184dtb
Description
Low Power, High Slew Rate, Wide Bandwidth, Jfet Input Operational Amplifiers
Manufacturer
ON Semiconductor
Datasheet
10
NOTE 2
C
A
A1
B
E
SEATING
PLANE
–T–
H
8
1
e
8
D
0.25
1
F
B
–A–
M
4
5
G
C B
H
5
0.13 (0.005)
4
D
S
N
A
A
0.25
S
SEATING
PLANE
–B–
MC34181,2,4 MC33181,2,4
C
M
M
0.10
K
B
T
OUTLINE DIMENSIONS
A
M
h
M
PLASTIC PACKAGE
PLASTIC PACKAGE
X 45
B
CASE 626–05
CASE 751–05
L
_
D SUFFIX
P SUFFIX
M
ISSUE K
ISSUE R
(SO–8)
M
J
q
C
L
MOTOROLA ANALOG IC DEVICE DATA
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
3. DIMENSIONING AND TOLERANCING PER ANSI
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD
FORMED PARALLEL.
SQUARE CORNERS).
Y14.5M, 1982.
DIM
Y14.5M, 1994.
PROTRUSION.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
A
B
C
D
G
H
K
M
F
J
L
N
DIM
A1
A
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
9.40
6.10
3.94
0.38
1.02
0.76
0.20
2.92
0.76
–––
2.54 BSC
7.62 BSC
MILLIMETERS
MIN
0.25
1.35
0.10
0.35
0.18
4.80
3.80
5.80
0.40
1.27 BSC
0
_
10.16
MAX
6.60
4.45
0.51
1.78
1.27
0.30
3.43
1.01
10
MAX
0.50
1.75
0.25
0.49
0.25
5.00
4.00
6.20
1.25
_
7
_
0.370
0.240
0.155
0.015
0.040
0.030
0.008
0.030
0.115
MIN
–––
0.100 BSC
0.300 BSC
INCHES
MAX
0.400
0.260
0.175
0.020
0.070
0.050
0.012
0.135
0.040
10
_

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