hsdl-3600 Avago Technologies, hsdl-3600 Datasheet - Page 20

• Manufacturer Part Number: hsdl-3600
• Description: Irda Compliant 4 Mb/s 3 V Infrared Transceiver - Agilent Hewlett-packard
• Manufacturer: Avago Technologies

2.1 Recommended Metal
Solder Stencil Aperture
It is recommended that only
0.152 mm (0.006 inches) or
0.127 mm (0.005 inches) thick
stencil be used for solder paste
Figure 4.0 Solder Paste Stencil Aperture.
3.0 Pick and Place
Misalignment Tolerance and
Product Self-Alignment after
Solder Reflow
If the printed solder paste volume
is adequate, the unit will self-
align in the X-direction after
solder reflow. Units should be
properly reflowed in IR Hot Air
convection oven using the
recommended reflow profile. The
direction of board travel does not
matter.
l
SOLDER
PASTE
t, nominal stencil thickness
Aperture opening for shield pad is 2.8 mm x 2.35 mm as per land dimensions
0.152
0.127
mm
w, the width of aperture is fixed at 0.70 mm (0.028 inches)
printing. This is to ensure
adequate printed solder paste
volume and no shorting. The
following combination of metal
stencil aperture and metal stencil
thickness should be used:
inches
0.006
0.005
APERTURE AS PER
LAND DIMENSIONS
w
Theta – direction
X – direction
See Fig 4.0
t (STENCIL THICKNESS)
Allowable Misalignment Tolerance
2.8
3.4
mm
l, length of aperture
0.05
0.05
20
0.2 mm (0.008 inches)
+/- 2 degrees
0.110
0.134
inches
0.002
0.002