mcz1210ct201t TDK Corp., mcz1210ct201t Datasheet
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mcz1210ct201t
Manufacturer Part Number
mcz1210ct201t
Description
Chip Beads Smd Array For Audio Signal Line
Manufacturer
TDK Corp.
Datasheet
1.MCZ1210CT201T.pdf
(2 pages)
Chip Beads(SMD Array)
For Audio Signal Line
MCZ Series MCZ1210-T Type(3-Line)
This is a common type bead product that removes the noise
components in a signal line and includes beads for three lines in a
single chip. The product exhibits substantial impedance character-
istics in the high frequency range and is therefore capable of effec-
tively removing differential mode noises.
Additionally, an appropriate amount of magnetic coupling is creat-
ed between the beads of the three lines, giving the product the
capability to remove not only differential mode noise but common
mode noise as well. It is encased in a 1210 casing. This is an SMD
product that allows for automatic mounting by taping.
FEATURES
• Compact size and for three lines
• Capable of removing both common and differential mode noises.
• Closed magnetic circuit structure allows high-density installation
APPLICATIONS
Audio signal lines used in cell phones and mobile audio devices.
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L× W
(3) Material code
(4) Number of line
(5) Impedance
(6) Packaging style
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
• Please contact our Sales office when your application are considered the following:
• All specifications are subject to change without notice.
MCZ 1210 C
(1)
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
while preventing crosstalk between circuits.
201: 200Ω at 100MHz
T:Taping
(2)
(3) (4) (5) (6)
T 201 T
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
CIRCUIT DIAGRAM
TEMPERATURE RANGES
Operating/Storage
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
• After mounting components onto the printed circuit board, do not
• The inductance value may change due to magnetic saturation if
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
0.225±0.1
• No polarity
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
apply stress through board bending or mishandling.
the current exceeds the rated maximum.
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
0.475±0.1
6
1
6
1
1.25±0.1
5
2
5
2
4
3
4
3
–40 to +85°C
Quantity
4000 pieces/reel
001-05 / 20061022 / e9421_mcz1210_3.fm
Dimensions in mm
Conformity to RoHS Directive
0.225
0.25
(1/2)
Related parts for mcz1210ct201t
mcz1210ct201t Summary of contents
Page 1
Chip Beads(SMD Array) For Audio Signal Line MCZ Series MCZ1210-T Type(3-Line) This is a common type bead product that removes the noise components in a signal line and includes beads for three lines in a single chip. The product exhibits ...
Page 2
... REEL DIMENSIONS 1.0 2.0±0.5 ø13±0.5 ø21±0.8 ø178±2.0 • All specifications are subject to change without notice. Insulation DC resistance resistance (Ω)max. (MΩ)min. 0.6 1 0.8 1 MCZ1210CT201T 400 350 300 250 200 150 100 TAPE DIMENSIONS 0.60±0.05 40min. 9.0±0.3 13.0±1.4 Dimensions in mm ...