mcz1210ah TDK Corp., mcz1210ah Datasheet - Page 4

• Manufacturer Part Number: mcz1210ah
• Description: Common Mode Filters For High-speed Differential Signal Line
• Manufacturer: TDK Corp.

Common Mode Filters
For High-speed Differential Signal Line
(USB2.0, LVDS, etc.)
MCZ Series MCZ2010AH
FEATURES
• Compact sized multilayer common mode filter.
• By providing wide bandwidth for differential mode, this product
APPLICATIONS
• High speed interface(LVDS and USB2.0) in electronics devices.
• PDP/LCD/DLP/PJ TVs, DVD players, notebook PCs, DVCs,
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L×W
(3) Product identification number
(4) Impedance[at 100MHz]
(5) Number of line
(6) Packaging style
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
• All specifications are subject to change without notice.
MCZ 2010 AH 900
250 to 260˚C
230˚C
180˚C
150˚C
(1)
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
has almost no effect for high-speed differential signals and can
suppress the radiated emission.
DSCs, amusement machines, portable audio, digital cellular
phones, etc.
900: 90Ω
T: Taping
L4: 4line
(2)
Preheating
60 to 120s
(3)
Time(s)
(4)
(5) (6)
L4
Soldering
30 to 60s
10s max.
T
Natural
cooling
SHAPES AND DIMENSIONS/
RECOMMENDED PC BOARD PATTERNS
CIRCUIT DIAGRAMS
・No polarity
TEMPERATURE RANGE
Operating
Storage(After mount)
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
• After mounting components onto the printed circuit board, do not
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
• This product does not apply to flow soldering construction
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
apply stress through board bending or mishandling.
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
method.
0.5±0.1
0.25±0.1
2.0±0.15
–25 to +85°C
–25 to +85°C
Quantity
5000 pieces/reel
Dimensions in mm
Weight: 5.0mg
001-02 / 20110928 / e9712_mcz_ah
Conformity to RoHS Directive
0.5
Dimensions in mm
0.25
(3/4)