hcpl-073a-560e Avago Technologies, hcpl-073a-560e Datasheet - Page 6

• Manufacturer Part Number: hcpl-073a-560e
• Description: Very Low Power Consumption High Gain Optocouplers
• Manufacturer: Avago Technologies

Small-Outline SO-8 Package (HCPL-070A, HCPL-073A)
Solder Reflow Thermal Profile
Figure 1a. Solder Reflow Thermal Profile.
6
TEMPERATURE
ROOM
(0.155 ± 0.005)
(0.016 ± 0.003)
3.937 ± 0.127
0.406 ± 0.076
(0.125 ± 0.005)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
3.175 ± 0.127
300
200
100
5.207 ± 0.254 (0.205 ± 0.010)
0
Note: Non-halide flux should be used.
0
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
PIN ONE
8
1
* 5.080 ± 0.127
(0.200 ± 0.005)
50
7
2
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
YWW
XXX
6
3
2.5°C ± 0.5°C/SEC.
5
4
100
(0.050)
TIME (SECONDS)
1.270
(0.236 ± 0.008)
(0.060)
5.994 ± 0.203
1.524
BSC
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
TEMP.
PEAK
245°C
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
200°C
TIME
200
7°
LAND PATTERN RECOMMENDATION
PEAK
TEMP.
240°C
(0.012)
0.305
TIGHT
TYPICAL
LOOSE
MIN.
TEMP.
PEAK
230°C
0.64 (0.025)
45° X
(0.008 ± 0.004)
0.203 ± 0.102
250
(0.017)
0.432
1.9 (0.075)
7.49 (0.295)
(0.009 ± 0.001)
0.228 ± 0.025