adg1421 Analog Devices, Inc., adg1421 Datasheet - Page 15

• Manufacturer Part Number: adg1421
• Description: 2.1 ? On Resistance, ?15 V/+12 V/?5 V Icmos Dual Spst Switches
• Manufacturer: Analog Devices, Inc.

OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADG1421BRMZ
ADG1421BRMZ-REEL7
ADG1421BCPZ-REEL7
ADG1422BRMZ
ADG1422BRMZ-REEL7
ADG1422BCPZ-REEL7
ADG1423BRMZ
ADG1423BRMZ-REEL7
ADG1423BCPZ-REEL7
1
Z = RoHS Compliant Part.
1
1
1
1
1
1
1
1
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
PIN 1 INDEX
SEATING
PLANE
AREA
0.80
0.75
0.70
IDENTIFIER
COPLANARITY
3.10
3.00
2.90
0.95
0.85
0.75
0.15
0.05
PIN 1
* FOR PROPER CONNECTION OF THE EXPOSED PAD PLEASE REFER TO
Figure 34. 10-Lead Lead Frame Chip Scale Package [LFCSP_WD]
OF THIS DATA SHEET.
THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION
0.10
Figure 33. 10-Lead Mini Small Outline Package [MSOP]
TOP VIEW
BSC SQ
3.00
COMPLIANT TO JEDEC STANDARDS MO-187-BA
3 mm × 3 mm Body, Very Very Thin, Dual Lead
0.50 BSC
10
1
0.80 MAX
0.55 NOM
Package Description
10-Lead Mini Small Outline Package [MSOP]
10-Lead Mini Small Outline Package [MSOP]
10- Lead Frame Chip Scale Package [LFCSP_WD]
10-Lead Mini Small Outline Package [MSOP]
10-Lead Mini Small Outline Package [MSOP]
10- Lead Frame Chip Scale Package [LFCSP_WD]
10-Lead Mini Small Outline Package [MSOP]
10-Lead Mini Small Outline Package [MSOP]
10- Lead Frame Chip Scale Package [LFCSP_WD]
3.10
3.00
2.90
Dimensions shown in millimeters
Dimensions shown in millimeters
6
5
0.30
0.15
Rev. 0 | Page 15 of 16
1.10 MAX
5.15
4.90
4.65
0.20 REF
(CP-10-9)
(RM-10)
0.50
0.40
0.30
0.05 MAX
0.02 NOM
6°
0°
0.30
0.23
0.18
15° MAX
6
5
0.23
0.13
(BOTTOM VIEW)
* EXPOSED
2.48
2.38
2.23
PAD
1
10
0.50 BSC
ADG1421/ADG1422/ADG1423
0.70
0.55
0.40
1.74
1.64
1.49
Package Option
RM-10
RM-10
CP-10-9
RM-10
RM-10
CP-10-9
RM-10
RM-10
CP-10-9
Branding
S2V
S2V
S2V
S2W
S2W
S2W
S2X
S2X
S2X