74ahct1g32gv NXP Semiconductors, 74ahct1g32gv Datasheet
74ahct1g32gv
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74ahct1g32gv Summary of contents
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... Ordering information Table 1. Ordering information Type number Package Temperature range 74AHC1G32GW +125 C 74AHCT1G32GW 74AHC1G32GV +125 C 74AHCT1G32GV Name Description TSSOP5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm SC-74A plastic surface-mounted package; 5 leads Product data sheet Version SOT353-1 SOT753 ...
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... NXP Semiconductors 4. Marking Table 2. Marking codes Type number 74AHC1G32GW 74AHCT1G32GW 74AHC1G32GV 74AHCT1G32GV 5. Functional diagram Fig 1. Logic symbol Fig 3. Logic diagram 6. Pinning information 6.1 Pinning Fig 4. Pin configuration 74AHC_AHCT1G32_6 Product data sheet 74AHC1G32; 74AHCT1G32 Marking code AG CG A32 C32 Y 4 mna164 Fig 2 ...
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... NXP Semiconductors 6.2 Pin description Table 3. Pin description Symbol Pin GND Functional description Table 4. Function table H = HIGH voltage level LOW voltage level Inputs Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). ...
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... NXP Semiconductors 9. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/ V input transition rise and fall rate 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V) ...
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... NXP Semiconductors Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions For type 74AHCT1G32 V HIGH-level input voltage V LOW-level input voltage V HIGH-level output voltage 8 LOW-level ...
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... NXP Semiconductors Table 8. Dynamic characteristics GND = 3.0 ns. For waveform see r f Symbol Parameter Conditions For type 74AHCT1G32 t propagation A and delay see Figure power per buffer; PD dissipation pF MHz; L capacitance V = GND to V ...
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... NXP Semiconductors Test data is given in Table 8. Definitions for test circuit Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance Z T Fig 6. Load circuitry for switching times 74AHC_AHCT1G32_6 Product data sheet 74AHC1G32; 74AHCT1G32 PULSE ...
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... NXP Semiconductors 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE ...
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... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions UNIT 0.100 0.40 1.1 0.26 mm 0.013 0.25 0.9 0.10 OUTLINE VERSION IEC SOT753 Fig 8. Package outline SOT753 (SC-74A) 74AHC_AHCT1G32_6 Product data sheet 74AHC1G32; 74AHCT1G32 scale ...
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... Release date 74AHC_AHCT1G32_6 20070702 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Package SOT353 changed to SOT353-1 in • ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 14 Abbreviations ...