isd1810 Winbond Electronics Corp America, isd1810 Datasheet - Page 15

• Manufacturer Part Number: isd1810
• Description: Single-chip, Single-message Voice Record/playback Device 8- To 16-second Durations
• Manufacturer: Winbond Electronics Corp America

IS D1810 Product
1.
2.
12
ISD1810
I.
I.
I.
T he backside of d ie is internally connected to V
may o ccur.
Die thickness is subject to change, p lease contact IS D f actory f or status and a vailability.
Die Dimensions
Die Thickness
PAD Opening
X:2530
Y:2420
11.5 ±0.5 mil (typ)
90 x 90 microns
Figure 10: ISD1810 Bonding Physical Layout (Unpackaged Die)
2
S S
. It MUST NOT be connected to any other potential or damage
P L AY L
MIC
MICR E F
PLA Y E
REC VS S D
AGC
S P –
ISD1810
R E CLED
V S S A
Voice Solutions in Silicon
S P +
VCCD
VCCA
XCL K
ROS C
F T
™